1.Position PCB substrate to avoid from floating and lifting under soldering.
2.Hight temperature resistent.
3.Easily handle
 

 

I.Features

1)Designed specifically for use in wave solder operations

2)Mostly made from molded plastic part, spring, screws and sleeve.

3)Working temperature: 200degree, max 280degree (10~20s).

4)The action is to press PCB board to protect it from floating and lifting under wave solder process so as to create excellent    solder tin.

 

II.Function

 Used to be positioned PCB substrate in wave solder pallets, fixtures and stencils to protect PCB substrate from floating and lifting.