Two 3D Engraving Laser Machines. Specially designed for Crystallex LLC. Composed of original German and Japanese parts. Specially designed software for individual and mass production. Programs help to prepare work files, generate a pointcloud, perform automatic batch conversion. Large collection of unique designs ready to engrave and 3D scanner included. Ready and tested approved and successful retail business concept.
Large machine (C1)
Industrial laser equipment with possibilities for incredibly easy huge automated mass production. Small-scale or big-scale crystals available. Double capacity by using additional loading table. Maximum crystal size 850×900 ×450 mm.
Small machine (C2)
Designed to manufacture individual 3D portraits, a limited size product range, using the equipment at different locations. Appropriate for retail business.
Specifications
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C1
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C2
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Size
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1800×2200×2100 mm
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500×500×800 mm
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Weight
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500 kg
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50 kg
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Input power
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4.5 KW
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2.5 KW
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Laser wavelength
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532 nm
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532 nm
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Laser type
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diode
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diode
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Laser mode of operation
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pulse
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pulse
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Repeat frequency
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2000 Hz
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2000 Hz
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Average productivity for 2D
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1930 pts/sec.
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1700 pts/sec.
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Average productivity for 3D
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1700 pts/sec.
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1700 pts/sec.
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Control system
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servo
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step-type
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Repeat Accuracy
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± 2 μm
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± 10 μm
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Control type
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deflector
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deflector
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Max. deflector capacity field
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38×38 mm, 100×100* mm
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60×60 mm
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Lens
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F-Theta, f=100
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F-Theta, f=120
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Max. crystal dimensions
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1000×1000×500 mm
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80×80×100 mm
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Max. working area
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850×900×200* mm
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60×60×80 mm
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| * extension lens (F-Theta, f=250) increases working area up to 850×900×450 mm | ||