Features:
Pulse heating. Rotary platform enhance throughput.
Imported temperature control system enhance accuracy, Accuracy< ± 2 ℃ . Temperature rising curve and parameter display synchronously.
High rigidness titanium alloy bond head ensures quality. Can maintain evenness under heavy duty from high temperature.
5.7 inches diagonal intelligent ergonomic interface. PLC enables the consistency and reliability of the entire equipment.
2 sets CCD alignment system. A lignment clear and accurate.
Ergonomic design of adjustable left-right table, convenient for production, saves cost and space.
Automatic temperature compensation feature increase accuracy of temperature.
Large memory for program storage, multifunctional operation menu helps the operation and preset more easy and convenient.
Suitable for all kinds of TAB, TCP bonding and FPC, FFC, PCB soldering or solder bonding.
Specification:
Control System LG-K 7M -DR-PLC
Operating Interface WEIVEW Full-Color PDA
Pressure Range 1-28.4kgf
Time Range 1-100s
Throughput 400-450PCS/H
Bond Head Accuracy ± 0.01mm
Temperature Accuracy ± 2 Degree Celsius
Product Min Pitch pitch ≥ 0.01mm
Product Max Size 7 inches diagonal
Alignment Min Width 10mm
CCD Magnification 70-120 X
Temperature steps 6(including start / away temperature)
Temperature rise time/step 1-2 s/step
Power 2-3KW
Thermocouple K Type
Weight 125KG
Dimension (L) 740mm × (W) 720mm × (H) 1480mm
Pulse heating. Rotary platform enhance throughput.
Imported temperature control system enhance accuracy, Accuracy< ± 2 ℃ . Temperature rising curve and parameter display synchronously.
High rigidness titanium alloy bond head ensures quality. Can maintain evenness under heavy duty from high temperature.
5.7 inches diagonal intelligent ergonomic interface. PLC enables the consistency and reliability of the entire equipment.
2 sets CCD alignment system. A lignment clear and accurate.
Ergonomic design of adjustable left-right table, convenient for production, saves cost and space.
Automatic temperature compensation feature increase accuracy of temperature.
Large memory for program storage, multifunctional operation menu helps the operation and preset more easy and convenient.
Suitable for all kinds of TAB, TCP bonding and FPC, FFC, PCB soldering or solder bonding.
Specification:
Control System LG-K 7M -DR-PLC
Operating Interface WEIVEW Full-Color PDA
Pressure Range 1-28.4kgf
Time Range 1-100s
Throughput 400-450PCS/H
Bond Head Accuracy ± 0.01mm
Temperature Accuracy ± 2 Degree Celsius
Product Min Pitch pitch ≥ 0.01mm
Product Max Size 7 inches diagonal
Alignment Min Width 10mm
CCD Magnification 70-120 X
Temperature steps 6(including start / away temperature)
Temperature rise time/step 1-2 s/step
Power 2-3KW
Thermocouple K Type
Weight 125KG
Dimension (L) 740mm × (W) 720mm × (H) 1480mm