Features:
High rigidness foundry and fully anti-aging treated machine body ensure long-run accuracy.
Pulse heating, Stepping temperature rising available. Accurate temperature control sensing which enables high quality of bonding interconnection bonding quality.
Rotary platform, double operation buttons and emergency stop enhance throughput and guarantees safety.
LCD ergonomic interface, Chinese or English displays, keyboard input, help operation easier.
2 sets CCD alignment system ensures accuracy.
Ergonomic design of table, convenient for production, saves cost and space.
High stability, manual/auto/ footrest switch feature can be used according to different preferences
Suitable for all kinds of LCD, HSC, PCB interconnection bonding; TAB, TCP interconnection bonding and FPC, FFC, PCB soldering or solder bonding.
Specification:
Control System Japan PLC
Pressure Range 3-44kgf
Time Range 1-100s
Throughput 350-400PCS/H
Bond Head Accuracy ± 0.01mm
Temperature Accuracy ± 2.5 Degree Celsius
Product Min Pitch pitch≥ 0.05mm
Product Max Size 7 inches diagonal
Alignment Min Width 10mm
CCD Magnification 70-120 X
Temperature steps and range 6(including start / away temperature)
Temperature rise time/ step 2-2.5 s/step
Power 2-3KW
Thermocouple K Type
Weight 150KG
Dimension (L) 680mm × (W) 650mm × (H) 1200mm
High rigidness foundry and fully anti-aging treated machine body ensure long-run accuracy.
Pulse heating, Stepping temperature rising available. Accurate temperature control sensing which enables high quality of bonding interconnection bonding quality.
Rotary platform, double operation buttons and emergency stop enhance throughput and guarantees safety.
LCD ergonomic interface, Chinese or English displays, keyboard input, help operation easier.
2 sets CCD alignment system ensures accuracy.
Ergonomic design of table, convenient for production, saves cost and space.
High stability, manual/auto/ footrest switch feature can be used according to different preferences
Suitable for all kinds of LCD, HSC, PCB interconnection bonding; TAB, TCP interconnection bonding and FPC, FFC, PCB soldering or solder bonding.
Specification:
Control System Japan PLC
Pressure Range 3-44kgf
Time Range 1-100s
Throughput 350-400PCS/H
Bond Head Accuracy ± 0.01mm
Temperature Accuracy ± 2.5 Degree Celsius
Product Min Pitch pitch≥ 0.05mm
Product Max Size 7 inches diagonal
Alignment Min Width 10mm
CCD Magnification 70-120 X
Temperature steps and range 6(including start / away temperature)
Temperature rise time/ step 2-2.5 s/step
Power 2-3KW
Thermocouple K Type
Weight 150KG
Dimension (L) 680mm × (W) 650mm × (H) 1200mm