Features:

Constant temperature heating, In & out feeding by sliding platform.

Double layers enhanced insulation. Accurate temperature control sensing.

Imported high precision slider feeding, bilinear bearing assist smooth moving.

Vacuum system installed. Can install different sizes of bond head.

Can install 2 sets CCD alignment system (Options).

Suitable for bonding HSC to LCD & PCB as well as ACF tacking (Pre-bond).



Specification:
Pressure Range 15.2-42kgf
Time Range 1-30s
Throughput 300-350PCS/H
Bond Head Accuracy ± 0.33mm
Temperature Range RT-399 Degree Celsius
Product Max Size 7 inches diagonal
CCD Magnification 40-100 X
Thermocouple K Type
Weight 35KG
Power 0.3KW
Dimension (L) 360mm × (W) 427 mm × (H) 388 mm