Product Main

Specifications

Features:

Constant temperature heating, high speed temperature rise/drop and auxiliary cooling feature.

Imported temperature control system enhance accuracy and speed-up temperature rising.

High accuracy imported screw adopted in the platform x axis, slider positioning synchronously. PLC set and save the IC position automatically according to the production requirement.

Full color ergonomic touch panel interface helps operation more convenient and visual.

Automatic counting feature can set limits, help throughput easier to monitor.

High magnification coaxial optical alignment system ensures the accuracy of product alignment.

System auto-check and abnormal warning display feature help maintenance faster.

Suitable for all kinds of bonding between TAB, FPC and PCB in 12- 32 inches TFT.



Specification:
Control System LG-K7M-DR-PLC
Operating Interface LG-K7M-DR-PLC

Pressure Range 1-28.2kgf
Time Range 1-100s
Throughput 180-240PCS/H
Bond Head Accuracy ± 0.01mm
Temperature Range RT-500 Degree Celsius
Product Min Pitch pitch≥ 0.02mm
Product Max Size 32 inches
Alignment Min Width 10mm
CCD Magnification 120-240 X
Power 0.75KW
Thermocouple K Type
Weight 225KG
Dimension (L) 1220mm × (W) 1220mm × (H) 1600mm