| Min. Line Width: | 0.15 |
|---|---|
| Board Thickness: | 1.6 |
| Copper Thickness: | 1 |
| Base Material: | PI FR-4 |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
Technology Capability
LAYERS:1-48Layers
Materials: FR-4,CEM-3,Halogen Free,Hi-TG,etc
Thickness: 0.2mm-3.0mm
copper thickness: 0.5OZ-6OZ
Solder Mask: Green,Blue,white,black,yellow,etc
Silkscreen: white,black
Surface treatment: OSP,(Leadfree)HAL,Gold-plating,Immersion gold/silver,etc
Other Technology:Gold finger, peelable mask, Non-across blind/buried vias, HDI,characteristic impedance control,high-precision impedance,high frequency h-Tg
LAYERS:1-48Layers
Materials: FR-4,CEM-3,Halogen Free,Hi-TG,etc
Thickness: 0.2mm-3.0mm
copper thickness: 0.5OZ-6OZ
Solder Mask: Green,Blue,white,black,yellow,etc
Silkscreen: white,black
Surface treatment: OSP,(Leadfree)HAL,Gold-plating,Immersion gold/silver,etc
Other Technology:Gold finger, peelable mask, Non-across blind/buried vias, HDI,characteristic impedance control,high-precision impedance,high frequency h-Tg