doubl side FPC
specifications:PI,0.2mm　yellow coverlay white slikscreen Immersion gold   impedance50OHM

Technology Capability
LAYERS:1-6Layers 
Materials: PI/PET/etc
Thickness: 0.075mm-0.4mm
copper thickness:1/3OZ-3OZ
Surface treatment: OSP,(Leadfree)HAL,Gold-plating,Immersion gold/silver,etc


 Below for Process Capability described


1. Layers: 1-48 layers

2. Material: FR-4, CEM-3,Aluminum, High TG, Rogers,Halogen Free, Teflon,etc.

3. Thickness: 0.2mm-8.0mm

4. copper thickness: 0.5OZ-10OZ

5. Solder Mask: Green,Blue,white,black,yellow,etc

6. Out layer circuit width/spacing: 3-3mil

7. Surface finished type: HASL, Flash gold, ENIG,,Immersion Gold,Immersion Silver, OSP etc.

8.Fly probe testing: prototype 100% test, small scale 100% test.AOI testing: 100%

9.Other Technology:Gold finger, peelable mask, Non-across blind/buried vias, HDI,characteristic impedance control, Rigid-flex board etc.