| Surface Finishing: | Immersion gold+Gold Finger |
|---|---|
| Min. Line Spacing: | 5MIL |
| Min. Line Width: | 5MIL |
| Min. Hole Size: | 10MIL |
| Board Thickness: | 1.6 |
| Copper Thickness: | 1/1/1/1oz |
| Base Material: | FR4 |
Quick Details
Specifications
Our General Capabilities:
Layer Count: 1-20 Layers
Material: FR-4, 170TG, Rogers, ISOLA ,Taconic,Arlon,Aluminum pcb
Min Plated Thru Holes: 0.15 mm
Min Aspect Ratio: 8:1
Copper: 6 oz Outer
Routing Tolerance: 0.1mm
Min Trace/Space: 0.076/0.076mm
Finish: HASL, Lead-free HASL, Hard Gold, Immersion Gold, Immersion Silver, OSP
Options: Selective Au, Carbon Ink, Peelable Mask, Micro Via, Controlled
Impedance, Score, LASER Drill, Blind Vias and Buried Vias.
Layer Count: 1-20 Layers
Material: FR-4, 170TG, Rogers, ISOLA ,Taconic,Arlon,Aluminum pcb
Min Plated Thru Holes: 0.15 mm
Min Aspect Ratio: 8:1
Copper: 6 oz Outer
Routing Tolerance: 0.1mm
Min Trace/Space: 0.076/0.076mm
Finish: HASL, Lead-free HASL, Hard Gold, Immersion Gold, Immersion Silver, OSP
Options: Selective Au, Carbon Ink, Peelable Mask, Micro Via, Controlled
Impedance, Score, LASER Drill, Blind Vias and Buried Vias.