Surface Finishing: | ENIG |
---|---|
Board Thickness: | 3.5mm |
Copper Thickness: | 2OZ |
Base Material: | FR4 |
Brand Name: | Derek |
Min. Line Spacing: | 3mil |
Min. Line Width: | 3mil |
Min. Hole Size: | 0.25mm |
Number of Layers: | |
Model Number: | Derek-R16 |
Place of Origin: | China (Mainland) |
Layer count: | 10 layers |
Holes: | Buried/Blind vias |
Solder mask: | Green |
Legend: | White |
Application: | Autombile |
Process: | BGA |
Test: | Fly probe test, electronic test |
Quick Details
Specifications
Number of layer: 1-56L (Main 2-40 layers)
Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc.
Copper weight: 0.5OZ-6OZ(18mil-210mil)
Board thickness: 0.2-7.2mm(8mil-282mil)
Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI,
Etc.
Silk screen: White, blue, black, etc.
Solder mask: Green, black, red, blue, yellow, white, etc.
Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold,
Immersion Tin, Immersion Gold, Carbon ink, etc.
Test: Fly Probe test, fixture test
Performance test: 100% electricity performance test
Min hole size: 0.2mm, Laser 0.1mm
Min line width/Space: 3mil/2mil
Outline profile: Rout, V-cut, Bridge, Stamp hole
Max panel size: 1000*600mm for Single and double side, 600*600mm for
Multi-layer
Min panel size: 10*10mm
Hole center position tolerance: 0.05mm