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Quick Details

Surface Finishing: ENIG
Board Thickness: 3.5mm
Copper Thickness: 2OZ
Base Material: FR4
Brand Name: Derek
Min. Line Spacing: 3mil
Min. Line Width: 3mil
Min. Hole Size: 0.25mm
Number of Layers:
Model Number: Derek-R16
Place of Origin: China (Mainland)
Layer count: 10 layers
Holes: Buried/Blind vias
Solder mask: Green
Legend: White
Application: Autombile
Process: BGA
Test: Fly probe test, electronic test

Specifications

Multi Layer Circuit Board 10 Layers Communication Devices Rigid PCB
Number of layer: 1-56L (Main 2-40 layers)
Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc.
Copper weight: 0.5OZ-6OZ(18mil-210mil)
Board thickness: 0.2-7.2mm(8mil-282mil)
Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, Etc.
Silk screen: White, blue, black, etc.
Solder mask: Green, black, red, blue, yellow, white, etc.
Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc.
Test: Fly Probe test, fixture test
Performance test: 100% electricity performance test
Min hole size: 0.2mm, Laser 0.1mm
Min line width/Space: 3mil/2mil
Outline profile: Rout, V-cut, Bridge, Stamp hole
Max panel size: 1000*600mm for Single and double side, 600*600mm for Multi-layer
Min panel size: 10*10mm
Hole center position tolerance: 0.05mm