Improved Bond Systems

Besides choice of the correct Diamond girt, the bond system is the key to get superior grinding result. Great Effort is made to innovate and improve the previous bond system. Several Exclusive bond system lines (no porosity series, high porosity series) are Offered to meet different grinding purpose.

Super-Fine Girt Size Available

with the demand of extremely Smooth cutting edge, we recommend super-fine grit size wheel to customers. D3(4000#) and D7(3000#) grit size now are available, they provide you superior Cutting edge chipping <5 μm. 

Easy to dress

Stable grinding performance based on improved bond system

Cutting-edge chipping <5 μm through the use of super-fine grit size

Multiple bond systems aim at Different working condition

Recommended Parameter

Grinding wheel speed ---- 14 ~ 26 m/s

Dressing wheel speed ---- 6 ~ 26 m/s

Dressing amount ---- 0.02 ~ 0.05 mm

Oscillation ---- 10 ~ 120 Passed/min

Application Example 1: PCD Inserts Grinding Vitrified Bond Diamond Grinding Wheel

Grinding Machine	EWAG EasyGrind
Coolant	Emulsion
Workpiece	PCD Insert (brazed, include carbide )
Grinding Parameters
Feed Rate	VF = 2mm/min
Stock	0.3mm
Cutting Speed	VC=
Advantage
1, 35%-time savings 2, 20% working life time increase 3, Chipping < 10μm