PRODUCTS Single-sided Double-sided Multilayer up to 24 layers Flex Rigid-flex Microvia with blind/buried vias High frequency/speed High temperature Metal core Lead free Halogen free MATERIALS CEM-1, CEM-3 FR-4 High Tg FR-4 High speed / High frequency Halogen-free laminate Metal Core Polyimide Polyester TECHNOLOGIES Laser drilling Blind /Buried via Via plugging Slot cutting Controlled impedance Liquid photo-imageable solder mask (LPI) Heavy copper Mix material SURFACE FINISHINGS HAL (hot air levelling) Lead free HAL (lead free hot air levelling) OSP (organic solderability preservatives) Electroless immersion tin Electroless immersion nickel/gold Electrolytic flash gold Selective nickel/gold Conductive carbon ink Gold tab/finger Peelable solder mask