Hi-Tg Thick Copper Board with Blind and Buried Holes 1,Material:FR-4 TG=170 2,Copper Wt for I/O layer:4OZ 3,Layer Count:16-layer 4,Board Thickness:3.0mm 5,Blind & Buried Holes:2-3,1-8,9-16 6,Finish:Immersion Au