Material:FR-4 Layer Coverage:4Layers Thickness:1.6mm Surface Technique:Immersion Gold Line Width/Space:6mil/6mil Solder Mask Color:Yellow Rigid PCB Capabilities Layers:1-30 Layers HDI pcb: 1+n+1,2+n+2,3+n+3 Thickness : 0.2 -12.7 mm Track - Gap : Min. 0.075 mm Min. Holesize: 0.05 mm micro via for Laser driller, Min. 0.15mm via for NC driller Max. PCB size : 23inch*35inch(584.2mm*889mm) Impedance Tol. : 4 - 30 Layers up to 50Ω +/- 5 Ω; over 50 Ω +/- 5% Aspect ratio : 20:1 Material : FR1, FR2, HB for single-sided, FR4 with High-Tg or Halogen Free, CEM3, Rogers, Aluminium based, Leadfree compatible, Taconic, Hi Frequency. Surface treatment : Chem.Ni/Au, immersion Sn,/Silver, HASL Leadfree, OSP, Flash Gold, HASL&HASL Leadfree+gold finger, conductive carbon ink. Copper weight : 0.5 Oz, 1 Oz, 2 Oz, 3 Oz, up to 12 Oz