Specifications
- We provide Contract Turnkey Manufacturing and ODM with One-stop service
- Contract manufacturing service applicable in medical, networking, peripherals and telecommunications
- ODM hardware experience:
- Networking component: CPU: Intel, AMD, Motorola, IDT, ARM, MIPS
- PHY: Broadcom, Galileo/Marvell, Intel
- Network processor: Broadcom, MMC/AMCC, Entridia, Agere, Vitesse, C Port
- Traffic manager: MMC/AMCC, Vitesse, Acorn
- Search engine: MMC/AMCC, NetLogic, Lara Networks, Mosaid, PMC-Sierra
- Crypto engine: Broadcom, HiFn
- Switching core: Broadcom, Galileo/Marvell, MMC/AMCC, Vitesse, Switchcore, Intel, Power X, Connexant, Zettacom
- xDSL: Broadcom, TI, Metalink, Infineon CPE Processor : Alchemy, Virata, Ishoni, TI, Brecis, PMC-Sierra FPGA: Xilinx, Altera
- Industry Standard: ANSI, ITU, IEEE, Bellcore FCC, NEBS, CE, UL, CSA, VDE, IEC
- Software experience:
- Networking: Internetworking: TCP/IP Stack, Ethernet
- Switching/Bridging: STP, RSTP, MSTP, GVRP, GMRP, Link Aggregation
- Routing: RIP, OSPF, BGP Multicasting : IGMP, DVMRP, PIM
- Security: IPSec, NAT, Firewall, ACL, AAA
- Remote access: PPP, L2TP, GRE QoS: Diffserv, Intserv, MPLS Management
- Interface: CLI, Web; Engine: MIB, SNMP NMS/EMS
- Embedded system software
- OS: VxWorks, Nucleus, pSOS, Cisco IOS, Linux
- CPU Architecture: MIPS, PowerPC, ARM, 8051
- Device driver: Ethernet, PCI, Switching Engine
- Microcode: Network Processor, Search Engine, Crypto Engine
- Multiprocessor system: inter-processor communication/synchronization, distributed processing
- Networking platform: Standalone, Stackable, Modular, Multi-slot Chassis, Layer 2/3 LAN Switch, Multi-service multi-protocol switch
- High availability: fault tolerance, redundancy