Product Main

Specifications

  • We provide Contract Turnkey Manufacturing and ODM with One-stop service
  • Contract manufacturing service applicable in medical, networking, peripherals and telecommunications
  • ODM hardware experience:
    • Networking component: CPU: Intel, AMD, Motorola, IDT, ARM, MIPS
    • PHY: Broadcom, Galileo/Marvell, Intel
    • Network processor: Broadcom, MMC/AMCC, Entridia, Agere, Vitesse, C Port
    • Traffic manager: MMC/AMCC, Vitesse, Acorn
    • Search engine: MMC/AMCC, NetLogic, Lara Networks, Mosaid, PMC-Sierra
    • Crypto engine: Broadcom, HiFn
    • Switching core: Broadcom, Galileo/Marvell, MMC/AMCC, Vitesse, Switchcore, Intel, Power X, Connexant, Zettacom
    • xDSL: Broadcom, TI, Metalink, Infineon CPE Processor : Alchemy, Virata, Ishoni, TI, Brecis, PMC-Sierra FPGA: Xilinx, Altera
    • Industry Standard: ANSI, ITU, IEEE, Bellcore FCC, NEBS, CE, UL, CSA, VDE, IEC
  • Software experience:
    • Networking: Internetworking: TCP/IP Stack, Ethernet
    • Switching/Bridging: STP, RSTP, MSTP, GVRP, GMRP, Link Aggregation
    • Routing: RIP, OSPF, BGP Multicasting : IGMP, DVMRP, PIM
    • Security: IPSec, NAT, Firewall, ACL, AAA
    • Remote access: PPP, L2TP, GRE QoS: Diffserv, Intserv, MPLS Management
    • Interface: CLI, Web; Engine: MIB, SNMP NMS/EMS
    • Embedded system software
    • OS: VxWorks, Nucleus, pSOS, Cisco IOS, Linux
    • CPU Architecture: MIPS, PowerPC, ARM, 8051
    • Device driver: Ethernet, PCI, Switching Engine
    • Microcode: Network Processor, Search Engine, Crypto Engine
    • Multiprocessor system: inter-processor communication/synchronization, distributed processing
    • Networking platform: Standalone, Stackable, Modular, Multi-slot Chassis, Layer 2/3 LAN Switch, Multi-service multi-protocol switch
    • High availability: fault tolerance, redundancy