CWPC-1A

Extremely short cycle time with rotary table design. Product loading and unloading can be done during the heat sealing process

High quality heat seal application up to 0.25mm pitch

Pneumatic bonding head provide up to 3,900N force

Digital programmable pressure control with LCD display

Closed loop PID temperature control with visible LED display

Bonding cycle is triggered by a real time pressure sensor

Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD and/or PCB

Precision product fixtures (2X), easy exchange, provided with micrometer alignment and vacuum to fix components

Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch application

Full microprocessor logic control