Product Main

Specifications

Main business scope:
1.      Turnkey electronic contract manufacturing
2.      Complete electronic assembly
3.      Single- and double-sided PCB assembly
4.      Cable assembly
5.      Wireless harness assembly
6.      Supply chain management
7.      Surface mount (SMT), through-hole and mixed PCA
8.      Ball grid array (BGA) assembly
9.      Press-fit and back plane assembly
10.  Electro-mechanical and subassembly builds
11.  Complete box builds
12.  Flying probe test, in-circuit test, and functional test
13.  RoHS compliant/Pb free procurement and assembly