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SMT Lead-free solder
(alloySn96.5/A3.0/Cu0.5,alloySn98.5/Ag1.0/Cu0.5,alloy Sn99/Ag0.3/Cu0.7)
1.Good performance of anti-collapsing
2Rare phenomenon of solder balling and tombstone.
3.Good performance of printing and stability, and mucosity.
4.JP PAT No,3027441,USA PAT No.5527628