Technical description of Multilayer PCB:
Material: FR-4
Layer: 6
Thickness of board: 1.6MM
Surface finish: Flash gold
Min. Hole size: 0.1mm(4mil)
Min. Line width: 0.075mm3mil)
Min. Line space: 0.1mm(4mil)
Special technique: Blind & buried Vias+Impedance control
lamination: 1-2,2-3,3-4
Use: Mobile phone
Hitech Circuits is a PCB manufacturer from China and we focus on mulitlayer printed circuit board; High density PCB /HDI, hard gold board; Flexible board / FPCB; Bergquist Aluminum based board, the ranging from 1L up to 26L. If you have interest in our Multilayer PCB, please contact us freely.