1.PCB design, layout, fabrication, assembly and function test
2.0402 placement
3.IC precision: 0.4mm
4. Lead-free technology SMT process
5.Up to 22 layers mixed assembly technology used on communications
6.Specialized in assembling boards for Network and communication, industry control
7.Type of productions:
8.SMT, though-hole
9.BGA and COB
10.Plastic injection
11.Die-casting
12.Sheet metal stamping
13.AOI,X-ray and ICT test