Smart Card Antenna Embedding Machine YCA-23
This machine adopts the first-class servomotor multiaxial controllers and the first-class 70kHz ultrasonic generator (SONOBOND by USA). It has high precision and high stability. The machine has higher productivity based on double worktable with high efficiency sealing heads. It is one of the fastest antenna embedding machines at present in the world.
Technical parameters:
- Applicable layout: 3×8
- Applicable material (carrier material): Plastic materials, PVC, ABS, PETG etc..
- Applicable material (copper wire):0.10-0.15mm
- The number of sealing head (wire laying head) : 3
- Size of table board: Two worktables 320*500mm
- Coiling space (minimum) :0.2mm
- Manner of control: CNC control system
- Ultrasonic generator:3 sets, 70kHz
- Moving part locating precision: 0.002mm
- Moving part repeating precision: 0.02mm
- Compressed air: 0.6MPa
- Air consumption: 65 liter/min.
- Rate of wire laying (max.) :400mm/s.
- Power supply: AC380V, 3-phase with 5-wire
- Power:2.5kW
- Weight:600kg
- Dimension:2000L×865W×1800H
- Speed: max.1500 pcs per hour (specific productivity depends on the parameters of the antenna/coil).
| LK Product Catalog | |||
| Sort | No. | Name & Model | |
| Contactless IC card processing equipment | 1 | Smart Card Antenna Embedding Machine YCA-13 | |
| 2 | Smart Card Antenna Embedding Machine YCA-23 | ||
| 3 | Smart Card Antenna Embedding Machine YCA-14 | ||
| 4 | Smart Card Antenna Embedding Machine YCA-24 | ||
| 5 | Smart Card Antenna Embedding Machine YCA-15 | ||
| 6 | Smart Card Antenna Embedding Machine YCA-25 | ||
| 7 | Smart Card Module Bonding Machine YCB-11 | ||
| 8 | Smart Card Module Bonding Machine YCB-13 | ||
| 9 | Smart Card Module Bonding Machine YCB-23 | ||
| 10 | Smart Card Module Bonding Machine YCB-14 | ||
| 11 | Position Hole Punch Machine YCPP-2A | ||
| 12 | Automatic Hole Punch Machine YCPH-4A | ||
| 13 | Module Cutting Machine YCPM-3A | ||
| Contact IC card processing equipment | Automatic | 14 | Automatic IC Card Milling Machine YC-ICM |
| 15 | Automatic IC Card Embedding Machine YC-ICE | ||
| Semi-Automatic | 16 | Semiautomatic IC Card Milling Machine YC-ICSM | |
| 17 | Semiautomatic IC Card Embedding Machine YC-ICSE | ||
| 18 | Semiautomatic IC Card Module Die-Cutter Machine YC-ICSP | ||
| SIM card processing equipment | 19 | SIM Card Plug-in Punch Machine YC-ICP | |
| Card Laminator | Single tower | 20 | Laminator YCY-115B 420×520 |
| 21 | Laminator YCY-115C 250×350 | ||
| 22 | Laminator YCY-115F2 250×350 | ||
| 23 | Laminator YCY-115FA3 350×500 | ||
| 24 | Laminator YCY-115Z 425×520 | ||
| Double tower | 25 | Laminator YCY-215A 550×640 | |
| 26 | Laminator YCY-215B 450×655 | ||
| 27 | Laminator YCY-215D 420×520 | ||
| 28 | Laminator YCY-215H 350×500 | ||
| 29 | Laminator YCY-215M 250×350 | ||
| 30 | Laminator YCY-215MA3 350×500 | ||
| 31 | Laminator YCY-215X 550×750 | ||
| Card Punch machine | 32 | Card Punch Machine YCK-2AM 2×5 | |
| 33 | Automatic Card Punch Machine YCK-2A 2×5 | ||
| 34 | Automatic Card Punch Machine YCK-3A 3×10 | ||
| 35 | Automatic Card Punch Machine YCK-4A 4×10 | ||
| 36 | Automatic Card Punch Machine YCK-5A 5×5 | ||
| Embosser | 37 | Embosser YCT-3 | |
| Special shape card processing equipment | 38 | Special shape card Punch Machine YC-TAGP | |
| Hot Stamping | 39 | Position Hot Stamping Machine YCH-6000 | |
| Magnetic strip spot bonding | 40 | Magnetic Strip Spot Bonding Machine YCM-3×8 | |
| 41 | Magnetic Strip Spot Bonding Machine YCM-4×8 | ||
| 42 | Magnetic Strip Spot Bonding Machine YCM-4×5 | ||
| 43 | Magnetic Strip Spot Bonding Machine YCM-5×5 | ||
| Spot bonding | 44 | Spot Bonding Machine YCD-2 | |
| 45 | Spot Bonding Machine YCD-3 | ||
| Assistant equipment | 46 | Turn plate equipment YCY-FB 470×520 | |
| 47 | Lifter YCL-215D 420×520 | ||
| Personalized Data equipments | 48 | Smart Card Personalized Data Writer YLG-A | |
| 49 | Smart Card Personalized Data Writer YLG-E | ||
| 50 | Smart Card Module Personalized Data Writer YLM-A | ||