Card Embosser YCT-3
Embosser YCT-3 can complete embossing and tipping at one time with the speed of 6000 cards per hour. It applies PLC, touch screen and Step-motion system from MITSUBISHI, There are 2 sets of character matrixes for both big size type and small size type. While changing the type, there is no need to change and install the matrixes. By setting program, it may eliminate the letters like “4” and “7”. The speed cannot be affected by the quantity of the code digits. This machine is not applicable for a random code.
Technical parameters
- Applicable material: PVC or other plastic material
- Thickness of card: 0.4-0.8mm
- Size of card: 54×85.6mm
- Pressure of hydraulic system: no more than 50 KG/cm2
- Pressure of compressed air: 5 KG/cm2
- Max. code digit: 19 digits, 3 fixed codes+16 digit number codes
- Production: 6000 cards/hr.
- Power supply: AC380V 50/60Hz
- Power: 2.5kW
- Weight: 450kg
- Dimension: L1700×W800×H1700 mm
| LK Product Catalog | |||
| Sort | No. | Name & Model | |
| Contactless IC card processing equipment | 1 | Smart Card Antenna Embedding Machine YCA-13 | |
| 2 | Smart Card Antenna Embedding Machine YCA-23 | ||
| 3 | Smart Card Antenna Embedding Machine YCA-14 | ||
| 4 | Smart Card Antenna Embedding Machine YCA-24 | ||
| 5 | Smart Card Antenna Embedding Machine YCA-15 | ||
| 6 | Smart Card Antenna Embedding Machine YCA-25 | ||
| 7 | Smart Card Module Bonding Machine YCB-11 | ||
| 8 | Smart Card Module Bonding Machine YCB-13 | ||
| 9 | Smart Card Module Bonding Machine YCB-23 | ||
| 10 | Smart Card Module Bonding Machine YCB-14 | ||
| 11 | Position Hole Punch Machine YCPP-2A | ||
| 12 | Automatic Hole Punch Machine YCPH-4A | ||
| 13 | Module Cutting Machine YCPM-3A | ||
| Contact IC card processing equipment | Automatic | 14 | Automatic IC Card Milling Machine YC-ICM |
| 15 | Automatic IC Card Embedding Machine YC-ICE | ||
| Semi-Automatic | 16 | Semiautomatic IC Card Milling Machine YC-ICSM | |
| 17 | Semiautomatic IC Card Embedding Machine YC-ICSE | ||
| 18 | Semiautomatic IC Card Module Die-Cutter Machine YC-ICSP | ||
| SIM card processing equipment | 19 | SIM Card Plug-in Punch Machine YC-ICP | |
| Card Laminator | Single tower | 20 | Laminator YCY-115B 420×520 |
| 21 | Laminator YCY-115C 250×350 | ||
| 22 | Laminator YCY-115F2 250×350 | ||
| 23 | Laminator YCY-115FA3 350×500 | ||
| 24 | Laminator YCY-115Z 425×520 | ||
| Double tower | 25 | Laminator YCY-215A 550×640 | |
| 26 | Laminator YCY-215B 450×655 | ||
| 27 | Laminator YCY-215D 420×520 | ||
| 28 | Laminator YCY-215H 350×500 | ||
| 29 | Laminator YCY-215M 250×350 | ||
| 30 | Laminator YCY-215MA3 350×500 | ||
| 31 | Laminator YCY-215X 550×750 | ||
| Card Punch machine | 32 | Card Punch Machine YCK-2AM 2×5 | |
| 33 | Automatic Card Punch Machine YCK-2A 2×5 | ||
| 34 | Automatic Card Punch Machine YCK-3A 3×10 | ||
| 35 | Automatic Card Punch Machine YCK-4A 4×10 | ||
| 36 | Automatic Card Punch Machine YCK-5A 5×5 | ||
| Embosser | 37 | Embosser YCT-3 | |
| Special shape card processing equipment | 38 | Special shape card Punch Machine YC-TAGP | |
| Hot Stamping | 39 | Position Hot Stamping Machine YCH-6000 | |
| Magnetic strip spot bonding | 40 | Magnetic Strip Spot Bonding Machine YCM-3×8 | |
| 41 | Magnetic Strip Spot Bonding Machine YCM-4×8 | ||
| 42 | Magnetic Strip Spot Bonding Machine YCM-4×5 | ||
| 43 | Magnetic Strip Spot Bonding Machine YCM-5×5 | ||
| Spot bonding | 44 | Spot Bonding Machine YCD-2 | |
| 45 | Spot Bonding Machine YCD-3 | ||
| Assistant equipment | 46 | Turn plate equipment YCY-FB 470×520 | |
| 47 | Lifter YCL-215D 420×520 | ||
| Personalized Data equipments | 48 | Smart Card Personalized Data Writer YLG-A | |
| 49 | Smart Card Personalized Data Writer YLG-E | ||
| 50 | Smart Card Module Personalized Data Writer YLM-A | ||