Product Main

Specifications

  • Copper filling HDI Ⅲ
  • Internal number: 08HH003
  • Plating: copper filling
  • Board thickness: 0.85 ± 0.1mm
  • Dimple: ＜10 um
  • Registration to layer: ＜50 um
  • Line/space: 4/4 mil
  • Micro-via: 100um
  • Surface finish: ENIG and OSP
  • Material: EM22B(5)
  • Tg: 150℃