Copper filling HDI Ⅲ

Internal number: 08HH003

Plating: copper filling

Board thickness: 0.85 ± 0.1mm

Dimple: ＜10 um

Registration to layer: ＜50 um

Line/space: 4/4 mil

Micro-via: 100um

Surface finish: ENIG and OSP

Material: EM22B(5)

Tg: 150℃