* Manufacture or design according to customer requirement
* Providing single,double sided, and multi-layered PCBS up to 12 layers
* SMT technology capability
* Through holes capability
* Quick prototype fast turnaround
* COB wire bonding technology
* Ultrasonic welding packaging
* Blister pack according to customer"s requirement
* RoHs capability
* BGA assembly, components on consigment
* OEM available