· Manufacture or design according to customer requirement

· Providing single, double sided, and multi-layered PCBS up to 12 layers

· SMT technology capability

· Through holes capability

· Quick prototype fast turnaround

· COB wire bonding technology

· Ultrasonic welding packaging

· Blister pack according to customer"s requirement

· RoHs capability

· BGA assembly, components on consigment

· Worldwide component procurement