* Manufacture or design according to customer requirement

* Providing single, double sided, and multi-layered PCBS up to 12 layers

* SMT technology capability

* Through holes capability

* Quick prototype fast turnaround

* COB wire bonding technology

* Ultrasonic welding packaging

* Blister pack according to customer"s requirement

* RoHs capability

* BGA assembly, components on consigment

* Worldwide component procurement