Board Type:HDI PCB/ HDI PWB/ Rigid PCB
1)Structure	1+C+1/2+C+2
2)Matreial	FR4/HighTG FR4
3)Copper thickness	max 1oz
4)Dielectric thickness	max 3mil
5)Pattern Width/Space	max 4/4mil
6)Laser Drill Hole	max 6mil
7)Layers	max 26
8)Characterestic Impedance	10%
9)Drill hole	Buried/Blind/Through hole
10)Surface Finish	HASL/LF HASL/ENIG/Gold Finger/Gold Plating/Immersion Tin/Immersion Silver
11)Certificate	UL 94 V-0/ROHS
12)Application Area	Mobile Phone/Substrate Board/Computer/Note Book
	Automobile/Medical/DVC/DC/others
13)Production	Pilot/Prototype/Mass Production
	Samples/Quick Turn
	High Mixture Low Volume(HMLV)