Technical requirements:

layer: 8 layer

Thickness: 0.8mm

finish coatting: Immersion gold

copper size: 1 oz

Solder mask: green

Material: FR-4

Min.hole size: 0.1mm(4mil)

Min.line width/space: 0.1mm/0.1mm(4mil/4mil)

Special technique: Blind & buried via+Impedance control

HDI 8 layer pcb board