Base Material: FR-4,CEM-3
Copper Thickness: 0.5OZ,1OZ,2OZ
Board Thickness: 0.4-3MM
Min. Hole Size: 0.3MM
Min. Line Width: 0.075MM 
Min. Line Spacing: 0.075MM
Surface Finishing: HASL,GOLD-PALTING,OSP,LEAD FREE HASL 
 
 
 
 

Layers: 2

The other surface finish we coulde do are:HAL,Immersion Tin,Immersion

Gold

The other solder mask we coulde do are:red,blue,white,black
Standard:UL,SGS,ROHS

Packing carton