Double sided flex printed circuit which is used for LCM.

Description                                        Specification
Basic Thickness (μm):                  Polyimide/Polyester: 12.5,25,35,50
Copper Thickness (μm):               12,18,35,70,105
Min Line Width (mm):                   0.075
Min Line Space (mm):                   0.075
Min Hole (mm):                             0.2-0.25
Peel Strength (N/mm):                   Above 1.0
Flexural Endurance:                       Above 100 thousands
Tolerance:                                     Figuration±0.05          Coverlayer±0.2
Solder Resistance:                         PI: 260℃ 10sec./204℃ 5sec.
Insulation & Solder Resistance:      No spark,disruption or flashover with 500VCD
Insulation Resistance (MΩ):            ≥500
Flexural Resistance:                        Flex with R0.25 three times no split
Criteria:                                          IPC-6013