Single sided dual acess which is used for telecommunication.

Description                                        Specification
Basic Thickness (μm):                  Polyimide/Polyester: 12.5,25,35,50
Copper Thickness (μm):              2,18,35,70,105
Min Line Width (mm):                  0.075
Min Line Space (mm):                  0.075
Min Hole (mm):                            0.2-0.25
Peel Strength (N/mm):                  Above 1.0
Flexural Endurance:                      Above 100 thousands
Tolerance:                                    Figuration±0.05          Coverlayer±0.2
Solder Resistance:                        PI: 260℃ 10sec./204℃ 5sec.
Insulation & Solder Resistance:     No spark,disruption or flashover with 500VCD
Insulation Resistance (MΩ):           ≥500
Flexural Resistance:                       Flex with R0.25 three times no split
Criteria:                                         IPC-6013