Two- to Four-Layer Rigid-Flex PCBs with FR4/HDI-PDA Laminate Material

Key Specifications/Special Features:

Number of layers: 2 to 4

Thickness: 12 mil only

Thermal performance: 30% better conduction than standard 0. 062-inch FR4

New FR4 technology from photo circuit

New thermally conductive adhesive technology

Suitable for body through power train controller application