Technical discription of Multilayer Printed Circuit Board
Layer:8 layers
Material: FR-4
Board thickness: 1.6mm High TG170
Surface finish: immersion gold
Solder mask:Green
Silkscreen:White
Min throuhg hole: 0.1mm(4mil)
Min line width: 0.075mm(3mil)
Min line space: 0.1mm(4mil)
Special requirements: Buried and blind vias+controlled impedance +BGA
Hitech Circuits is a PCB manufacturer from China and we focus on mulitlayer printed circuit board; High density PCB /HDI, hard gold board; Flexible board / FPCB; Bergquist Aluminum based board, the ranging from 1L up to 26L. If you have interest in our service and products, please contact us freely.