Thermal phase change materials are solid pads at room temperature that melt at operating temperature from inimate contact on the mating surface to produce low thermal resistance.

Benefits and features:

supplied on roll with top tabbed liners for easy application;clearly superior to thermal grease application;provides superior surface wetting ,minimum bondlines thicknese and actively expels entrapped air ,all leading to maximum thermal performance of any available phase change material .Designed to provide stable and reliable performance.

Application:

microprocessors;chipsets;graphics processing units;custom ASICS;power components and modules;memory modules.