Specification

Application

All through-hole component as IC, transform, connector, and so on.

 

Soldering process

Lead or lead free

 

Soldering process

Two modules, manual control or automatic program control. One solder process can be divided into different section of soldering with different height and last time. Can be programmed one wave soldering and two times soldering like double wave soldering.

 

Soldering peak height

0 to 10 mm above nuzzle, programmable

 

Solder pump

Propeller driven by servo motor

 

Lead free pump

Made by titanium (Optional)

 

Control unit

PLC of Siements, LCD display of the parameter, small key board as operate panel, foot switch

 

Soldering peak high

Programmable controlled by PLC

 

Soldering wave up speed

Programmable

 

Soldering wave down speed

Programmable

 

Soldering time

Programmable

 

Soldering temperature

PID close loop control by PLC Max. 380 Celsius

 

Standard nuzzle

(Optional)

 

Special nuzzle

Customer request design(Optional). Some nuzzle can be used to soldering desoldering two component in different position of the board by one time soldering process.

 

Air solders cleaning

Used to cleaning the solder dross left in the hole after take off the component

 

Standard air nuzzle

(Optional)

 

Special air nuzzle

Customer request design (Optional)

 

Protection

Temperature high limitation set by programmer

 

Heater

Electricity, Max 1,200 w

 

Material

Stainless steel

 

Board holder

Slide movement by rail manual

 

PCB max.

600 x 500 mm

 

Component length

Max. 220 mm

 

Board holder shift

400 mm to left

 

Board holder height

Max. 25mm adjustable manual

 

Size

Width 490 Height 360 Deep 720mm

 

Weight

40 kg

 

Color

Blue and White, or at request

 

Solder pot capacity

16 kg

 

Power supply

220 V

 

Working environment

Above 20 degree Celsius