Layer:1-20 layers
Material:FR4,CEM1,CEM3,FR2, Aluminium base
Copper thickness:1/3OZ-4OZ
Board thickness:0.15-3.2mm
Min line width/spacing:0.1/0.1mm
Min drilling hole size:0.20mm
Advanced technologies: Blind/Buried Via, HDI Micro via
Surface finishing:HAL,HAL(Lead-free),Gold plating,Immersion Gold/Sliver/Tin,ENIG,OSP
Certificates:ISO9001,UL,ROHS
Price: Quite competitive especially for orders in huge quantities
Advantage: Good quality with reasonable price; quick delivery; without limitation for the ordering qty.