Our Capability:

Layer:1-20 layers

Material:FR4,CEM1,CEM3,FR2, Aluminium base

Copper Thickness:1/3OZ-4OZ

Board thickness:0.15-3.2mm

Min line width/spacing:0.1/0.1mm

Min drilling hole size:0.20mm

Advanced Technologies: Blind/Buried Via, HDI Micro via

Surface Finishing:HAL,HAL(Lead-free),Gold plating,Immersion Gold/Sliver/Tin,ENIG,OSP

Certificates:ISO9001,UL,ROHS

Price: Quite competitive especially for orders in huge quantities

Advantage: Good quality with reasonable price; quick delivery; without limitation for the ordering qty.