Our Capability:

Layer: 1-20 layers

Material: FR4, CEM1, CEM3, FR2, Aluminium base

Copper Thickness: 1/3OZ-4OZ

Board thickness: 0.15-3.2mm

Min line width/spacing: 0.1/0.1mm

Min drilling hole size: 0.20mm

Advanced Technologies: Blind/Buried Via, HDI Micro via

Surface Finishing: HAL, HAL(Lead-free), Gold plating, Immersion Gold/Sliver/Tin, ENIG, OSP.

Certificates: ISO9001, UL, ROHS

Price: Quite competitive especially for orders in huge quantities.

Advantage: Good quality with reasonable price; quick delivery; without limitation for the ordering qty.