Mobile Phone PCB (RoHS) Layer: 8 Material: FR4 RoHS& UL standard Min line width: 0. 1mm Min line space: 0. 1mm The smallest hole: 0. 1mm Buried and blind via structure: L1-L3, L5-L7 Surface processing; Immersion gold Our PCB capability: Material used: FR4, High Tg Minimum 170C, Hifrequency, Metal based: Aluminium ect. Maximum Panel Size: 26" X 26" (660mm X 660mm) Line Width & Spacing: Minimum Line Width (Internal) 4 mil (0. 1 mm) for mass production and 3mil for samples Minimum Line Width (External): 4 mil (0. 1 mm) for mass production and 3 mils for samples. Minimum Line Spacing (External): 4 mil (0. 1 mm) for mass production and 3 mils for samples. Layer Count & Thickness: 2-12 layers Minimum Thickness (2 Layers): 4 mil (0. 1 mm) Minimum Thickness (4 Layers): 12 mil (0. 3 mm) Minimum Thickness (6 Layers): 16 mil (0. 4 mm) Minimum Thickness (8 Layers): 24 mil (0. 6 mm) Maximum Thickness(10layers): 200 mil (5. 0 mm) Layer to Layer Registration: +/- 5 mil (0. 13 mm) Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0. 25 mm) Minimum Via Size: 8 mil (0. 2 mm) Hole to Hole Tolerance: +/- 3 mil (0. 08 mm) Hole to Edge Tolerance: +/- 5 mil (0. 13 mm) Micro Via: 4 mil (0. 1 mm) Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0. 07 mm) Warpage: 0. 5 % Impedance: +/- 10% Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin Min. SMT Ptich: 12 mil (0. 2 mm) Min. parts footpins: 0201 Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.