1)Mainly applied in polysilicon ingot cleaning,etching and drying;
2)Process flow:Designed as customer required, available function including etching,cleaning, ultrasonic,heating,drying and others;
2)Process flow:Designed as customer required, available function including etching,cleaning, ultrasonic,heating,drying and others;
3)Control mode: Manual,semi-auto,Auto.;
4)Material:Depending on process and customer requirement,available matierials eg.PP,PVC,PVDF,Quartz Tube,Stainless steel and others;
Features and benefits:
A. Module design;Depending on customer requriment and process,offer special solution;
B. Customization based on customer budget;
C. Optimum wet cleaning solution;
D. High PPR;
E.Various options available:;
F. Operator friendly and safe;
G. Easy maintenance;
Non-standard product,please contact for special process solution with your requirement!