There have three used way for Solder paste: template printing, dispensing, pin transfer. In the three methods, the dispensing's automation and precision is the highest. It requires high thixotropy and uniformity for this kind of solder paste. It need to achieve consistent dispensing in the entire operation course, and it need higher requirement for the viscosity and chemical stability of this solder paste.
The packaging usually is
The specific characteristics of each alloy and its application can reference the products.