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Specifications

Chip beads have a high current with a high level of resistance
Chip inductor are small profile with low resistance
High-current chip inductor
Wire wound chip inductor
Ceramic chip inductor
Ferrite chip inductor
Molding chip inductor
Multilayer chip inductor
Common mode chip choke
Wire wound chip power inductor
Low profile power inductor
Low DCR SMD power inductor
Large-current SMD power inductor
SMD magnetically shield power inductor
Shielded SMD power chip inductor
Magnetic shielded surface mount inductor with high current rating
Low profile and shielded very effective in space-conscious applications
Low resistance to deep power loss minimum
Operating temperature: -40 to 105 degree Celsius (contain heating coil)
Appearance inspection: no external defect by visual inspection
Terminal strength: after soldering, between copper plate and terminals of coil, push in two directions of X, Y with standing as below conditions
Terminal should not peeled off
Heat endurance of reflow soldering: 240
Insulating resistance: over 100M ohms at 100V DC between wire and core
Dielectric strength: no dielectric breakdown at 100V DC for one minute between wire and core
Temperature characteristic: inductance coefficient (0 to 2,000) x 10-6/(-25 to +80 degree Celsius) inductance deviation within ±5.0%, after 96 hours
Humidity characteristic: in 90 to 95% relative humidity at 40 ±2 and one hour drying under normal condition
Inductance deviation within ±5.0% after vibration for one hour
Vibration resistance: in each of three orientations at sweep vibration (10-55-10Hz) with 1.5mmp-p amplitude

Surface-mount wire-wound Ceramic chip inductors
Surface-mount wound molded chip inductors
Surface-mount multi-layer chip array beads