1.Layer Count: 1-22 Layers HDI
2.Material: CEM1CEM3FR4High TG FR4halogen-free FR4aluminiumceramic etc.
3.Maximum Size: 610mm X 1200mm
4.Board Thickness: 0.125mm-6.0 mm
5.Minimum Line/Space: 0.075mm
6.Minimum Drilling Hole(Mechanical): 0.15mm
7.Minimum Laser Hole: 0.075mm
8.Copper Thickness: 17um--175um
9.Mini Solder Mask Bridge: 0.025mm
10.Impedance control tolerance: ±5%
11.Surface finishing: HASLlead free HASLimmersion goldimmersion tinimmersion silverplated goldOSPcarbon ink.
12.Solder Mask Color: Green, Red, White, Yellow, Black, Blue.
13.Quality standards: IPC-A-600F and MIL-STD-105D CHINA GB4588
14.Certificate: UL ,ISO9001:2000 , ISO14001:199