Glass fiber board fr-4 production quipment

item and parameters:

1.surface treatment :OSP,Shen tin,Shen silver,Lead-free,spray tin,nickel gold plating.

2.layer:2-16

3.width of smallest wire:0.076mm

4.minimum spacing wire:0.076mm

5.minimum line to disk.disk to disk space:0.076mm

6.minimum diameter of drill knife:0.2mm

7.minimum diameter of the hole pad:0.45mm

8.maximum prpportion of driling thickness:1:6.4

9.maximum measurement:500x650 mm

10.processing thickness:0.2-3.2mm

11.minimum width of hte green oil bridge:0.08mm

12.minimum unilateral window(of green oil clearance):0.05mm

13.minimum thickness of the green oil:0.05mm

14.solder mask:photographic solder mask.hot-solder mask.UVsolder mask.

15.minimum characters linewidth:0.1mil

16.minimum height characters:0.7mm

17.silk screen chiaracters&solder mask color:white,yellow,black,green,aureate.

18.data file format:GERBER.CAD.protel99se.PADS

198performance test:impedance. a short-circuit test. a test for governance

20.Various types of sheet metal for the PCB substrate processing:FR4.FR1.CEM-1.CEM-3.22F.height G

21.other testing requiements:Baptist-test.test Rally.impedance test

22.Special production process: jet-godfinger(blind orifice),v-shaped orifice

23.copper foil thickness:H/H OZ.1/1 OZ.2/2 OZ.3/3 OZ. 4/4 OZ.....

24.double-four sided layer:5-10days  six-eight sides layer:10-20days   eightlayers more than 15-20days