Glass fiber board fr-4 production quipment

Item and parameters:

1.Surface treatment :OSP,Shen tin,Shen silver,Lead-free,spray tin,nickel gold plating.

2.Layer:2-16

3.Width of smallest wire:0.076mm

4.Minimum spacing wire:0.076mm

5.Minimum line to disk.Disk to disk space:0.076mm

6.Minimum diameter of drill knife:0.2mm

7.Minimum diameter of the hole pad:0.45mm

8.Maximum prpportion of driling thickness:1:6.4

9.Maximum measurement:500x650 mm

10.Processing thickness:0.2-3.2mm

11.Minimum width of hte green oil bridge:0.08mm

12.Minimum unilateral window(of green oil clearance):0.05mm

13.Minimum thickness of the green oil:0.05mm

14.Solder mask:photographic solder mask.Hot-solder mask.UVsolder mask.

15.Minimum characters linewidth:0.1mil

16.Minimum height characters:0.7mm

17.Silk screen chiaracters&solder mask color:white,yellow,black,green,aureate.

18.Data file format:GERBER.CAD.Protel99se.PADS

198performance test:impedance. A short-circuit test. A test for governance

20.Various types of sheet metal for the PCB substrate processing:FR4.FR1.CEM-1.CEM-3.22F.Height G

21.Other testing requiements:Baptist-test.Test Rally.Impedance test

22.Special production process: jet-godfinger(blind orifice),v-shaped orifice

23.Copper foil thickness:H/H OZ.1/1 OZ.2/2 OZ.3/3 OZ. 4/4 OZ.....

24.Double-four sided layer:5-10days six-eight sides layer:10-20days eightlayers more than 15-20days