|
4 mils |
Aspect Ratio |
1 : 16 |
Min Finish hole diameter |
0.10mm |
Multi-layers |
Up to 16 layers |
Board thickness |
Minimum 0.25mm, Maximum 3.8mm |
Solder Mask |
LPI, Peelable ink, Carbon ink |
Legend |
Two Part epoxy and UV |
Surface Finishes |
HASL, Flash Gold, Immersion Silver, Immersion Tin, Immersion Ni/Au, OSP, Selective Hard Gold. |
Electrical Test |
Voltage : 10-250V |
Profiling |
Punching, Routing, V-Cut |
Gold finger thickness |
1-1.2 μm (Au) |
Maximum panel size |
610 mm X 508 mm (24” X 20”) |
Impedance Control |
+/- 10% |