1) Base material: FR-4 /FR-2/FR-1/CEM-3

2) Layers: 1~16

3) Base Board thickness: 0.3~3.2mm

4) Incombustibility: 94V-0

5) Mini. Hole Diameter: 0.25mm,

6) Min. line space/ width: 0.1mm,

7) Mini. Pad diameter: 0.076mm (outlayer)

8) Copper thickness: 0.25~3.0OZ

9) Solder mask: green/yellow/black/white/red/blue

10)Surface finishing:HAL/Lead free HAL, gold plating, OSP, Immersion gold, Gold finger, Rosin

11) Outline: routing, punching, V-cut.

12) Inner packing: vacuum package, Outer packing: carton

13) Quality standard: IPC-A-600F   IPC-ML-950

14) Sample standard: STD-105E-

15) SGS/ Rosh/UL compliance