1. High Luminous Efficiency: unified bonding the integrated structure chips make the luminous efficiency per watt of surface light-emitting light source module has significant increase compared to same level single-particle-chip.

2. Easy heat dissipation: cooling area expands several hundred times even over a thousand times compared with same power single-particle-chip.

3. Proprietary intellectual property rights: Light source with the unique flat-encapsulation technology.

4. Uniform illumination: average illumination over 20 lx, Degree of uniformity greater than 0.4. 5. Light power range from 45W to 200W