Product Range: Double-Sided, Multilayer, Blind-buried Hole, HDI, FPC, Rigid-Flex PCB.

Low-TG material: FR4 (TG135), CEM-1, CEM-3, Aluminum substrates.

High-TG material: FR4 (TG170), Rogers4003, Rogers4350, TEFLON, TACONIC, ARLON, Halogen-free.

Surface Treatment: Lead Free HAL, HAL, Panel Gold Plating, ENIG, OSP, Immersion Tin, Immersion Silver, Gold Finger Plating, Carbon Ink Printing.

Selective Surface Treatment: ENIG+OSP, ENIG+G/F, Panel Gold+Tin Plating, Panel Gold Plating+G/F, Immersion Silver+G/F, Immersion Tin+G/F.

Minimum Line Width: 3mil

Minimum Line Space: 3mil

Minimum Line-Pad, Pad-Pad Spacing: 3mil

Minimum Hole Diameter: 0.10mm /4mil

Minimum Via Hole Pad Diameter:: 12mil

HDI Type: 1+n+1,1+1+n+1+1,2+n+2

Minimum Laser-drilling Hole: 0.10mm (Depth≤55um), 0.13 (Depth≤100um)