Thermal Pads
Features&Benefits:
-Thermal conductivity:3.0w/m.k
-High thermal performance at cost effective
-Slightly tacky on both sides
-Low stress application
-Electrical isolating
Typical Application Includes:
-High power applications
-Notebook computers
-LED Lighting
-Mass storage drives
-Between CPU and heat spreaders
-Wireless/wireline communication devices
Configurations:
-Sheet form,die-cut parts
-Tape application available
Size available:
200x400mm
Thickness available:
0.5-5.0mm,increment by 0.5mm
Main Properties:
1.Thermal conductivity:3.0w/m.k ASTM D5470
2.Hardness:25±5Shore C ASTM D2240
3.Breakdown voltage:≥4.5KV ASTM D169
4.Continuous use temp.:-40-150°C EN344
5.Flame rating:UL 94 V-0
For more details and application direction,welcome to contact our sales!